报告题目：PCB SI and PI investigation with Tensorial Analysis of Networks (TAN)

报告时间：2018年12月29日（周六）上午9:00

报告地点：微波楼2楼会议室

报告人：Blaise Ravelo

主持人：万发雨

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电子与信息工程学院 

2018年12月27日

专家简介：

Dr. Blaise RAVELO is an associate professor Normandy University.  His research topic includes electronics circuit boards design/modelling, signal integrity and electromagnetic compatibility/interference (EMC/EMI) characterization. He is pioneer of the negative time-delay circuits and anticipated & advanced signal processing. He is (co-)authors of more than 210 scientific research papers in new technologies published in int. conf. and journals. With US, Chinese, Indian, European and African partners, he is actively involved and contributes on several research, development and innovation international research projects (ANR, FUI, FP7, INTERREG, H2020, Euripides², Eurostars…). He is the scientific chair of int. conf. ICONIC 2011, organizer and chairman of special sessions of int. conf.: META2012 (Paris), AES2012 (Paris), RADIO2014 (Mauritius), RADIO2015 (Mauritius) and EuCAP2015 (Lisbonne).

报告内容摘要：

The idea of proposing microstrip interconnection structures models was developed in the TECS project, INTERREG IV-A France-(Channel)-England program. The feasibility of this model has been validated with structures ('I', 'L', 'J', 'S', 'U', 'N', 'M', Z', ...) at a single-input-single-output=SISO. Then, the Symmetric (T', 'Y', 'H', 'X', ...) and asymmetric (F', 'E', 'comb', ...) single-input-multiple-output ('SIMO') analytical models of interconnection have been developed. The innovative SIMO-SISO transformation approach has been established to determine the [T], [S], [Z] and [Y] matrices of the structure. The effectiveness of this approach has been validated by simulation compared to commercial 3D EM simulation tools. This method has recently been improved for the behavior of electrical interconnections of passive 3D structures.